Precision SMT Assembly Solutions
Our high-precision surface-mount technology (SMT) assembly delivers reliable, high-volume production with exceptional accuracy. Equipped with fully automated pick-and-place systems and advanced reflow ovens, we handle components from 01005 chip sizes to large BGAs, ensuring perfect placement every time. Our SMT assembly ensures your boards meet IPC-A-610 Class 2/3 standards with consistent quality.
Production Capacity
- Capacity: Our integrated 7 automated production lines can achieve a monthly output of 52 million placements (0.15 seconds/chip, 0.7 seconds/QFP).
- Specifications: Accepted board sizes range from 0.25″x0.25″ to 680×500 mm, with component sizes of 0201 – 54 square millimeters (0.084 square inches). We provide a variety of options, including long connectors, 0201 packages, CSP, BGA, QFP, and more.
- Assembly: Single-sided, double-sided, rigid, flexible, rigid-flex combination.
- Equipment: Solder paste printer, SPI inspector, automatic solder paste printer, 10-zone reflow soldering, AOI, X-RAY, baking machine.
- Certifications: ISO13485, ISO 9001, IATF16949, ISO 14001, ISO 45001.
- Special Services: Design upgrades, component procurement, expedited projects, post-sales processing.
- Industries: Medical, aviation, automotive, IoT, consumer electronics, and more.
Quality Assurance
More than 15 of our personnel are involved in the quality control department, effectively controlling and managing essential processes like incoming material inspection, input quality control processes, outgoing quality control processes, etc.
