PCB Fabrication Specifications & Advanced Capabilities
Your PCB Design Guide: Manufacturing Limits & Standards
Explore our comprehensive PCB manufacturing capabilities, designed to meet the most demanding design requirements. Our advanced fabrication processes ensure precision and reliability. This table outlines our key specifications, including minimum drill sizes, material options, tolerances, and surface finishes, helping you design with confidence for prototypes or high-volume production.
PCB Manufacturing Capabilities & Specifications
| Item | Copper Weight (oz) | mm | mil |
|---|---|---|---|
| Minimum Track Width/Spacing | 1oz | 2-Layers : 0.1mm/0.1mm Multi-Layer: 0.09mm/0.09mm BGA fanout: 0.08mm/0.08mm | 2-Layers : 4mil/4mil Multi-Layer: 3.5mil/3.5mil BGA Fanout: 3mil/3mil |
| 2oz | 2-Layers : 0.16mm/0.16mm Multi-Layer: 0.16mm/0.2mm | 2-Layers : 6.5mil/6.5mil Multi-Layer: 6.5mil/8mil | |
| Track width tolerance | ±20% | ||
| Plated Through Hole (PTH) Minimum Annular Ring | 1oz | 2-Layers : Typical 0.254mm, Minumum 0.18mm Multi-Layer : Typical 0.2mm, Minumum 0.15mm | 2-Layers : Typical 10mil, Minumum 7mil Multi-Layer : Typical 8mil, Minumum 6mil |
| 2oz | 2-Layers : 0.254mm Multi-Layer : 0.254mm | 2-Layers : 10mil Multi-Layer : 10mil | |
| Non-Plated Through Hole (NPTH) Minimum Annular Ring | - | ≧0.45mm | ≧18mil |
| Minimum Same-Net Track Spacing | - | 0.254mm | 10mil |
| Minimum BGA Pad to Track Spacing | - | 0.09mm | 3.5mil |
| Minimum BGA Pad Diameter | - | 0.254 | 10mil |
| Hatched Grid Width/Spacing | - | 0.254 | 10mil |
| Minimum Via Hole to Inner Layers Copper Spacing | - | 0.2mm | 8mil |
| Minimum Via Hole to Track Spacing | - | 0.2mm | 8mil |
| Minimum PTH Hole to Inner Layers Copper Spacing | - | 0.3mm | 12mil |
| Minimum PTH Hole to Track Spacing | - | Typpical: 0.35mm Worst Cases: 0.28 | Typpical: 14mil Worst Cases: 11mil |
| Minimum NPTH Hole to Track Spacing | - | 0.2 | 8mil |
| Minimum SMD Pad to Pad Clearance | - | 0.15mm for 0402 Pads. Larger Pads need more spacing. | 6mil |
| Manufacturing Dimensions | Capability | Note |
|---|---|---|
| Maximum Dimensions | FR4 Thickness ≥ 0.8mm : 670 x 600 mm FR4 Thickness < 0.8mm : 600 x 500 mm 2-Layer FR4 : 1000 x 600 mm Aluminum : 600 x 500 mm Copper PCB : 480 x 280 mm | |
| Minimum Dimensions | PCB Thickness ≥ 0.6mm : 3 x 3 mm | Call for thinner PCBs |
| Dimension Tolerance | ±0.1mm | |
| Board Thickness (mm) | Less than 12-Layers: 0.5, 0.6, 0.8, 1.2, 1.6 and 2.0 mm 12-Layers and more : ≥ 2.5mm | |
| Thickness Tolerance when T＞1.0 mm | ±10% x T | |
| Thickness Tolerance when T≤1.0 mm | ±0.1mm | |
| Finished Outer Layer Copper | 1oz or 2oz | Including Plating |
| Finished Inner Layer Copper | 0.5oz by Default | 1oz or 2oz are also available |
| Panel Size (mm) | xxx | |
| Bow And Twist | ≤0.75% |
| Manufacturing Materials | Capability | Notes |
|---|---|---|
| FR4, Halogen-Free FR4 | Grade A materials from Nan Ya, KB, Shengyi, and other top-tier suppliers | Tg: 135C, 150C, 170C, etc. |
| Ceramic Filling High Frequency Material | Rogers 4003C/4350B | |
| PTFE High Frequency Material | Rogers Series, Arlon Series, Taconic Series, F4BM Series | |
| Special PP | NFPP: Arlon 49 N, VT47 Ceramic Filling PP: Rogers 4450F PTFE PP: Arlon 6700, Taconic FR-27 | |
| Rigid PI Material | Arlon 85 N, VT901 | |
| Metal Core | 1-Layer Aluminum and Copper Cores | |
| Material Mixed Laminate | 4 layers – 10 layers (FR4 + Ro4350, FR4 + Aluminium, FR4 + FPC) | |
| Note | Other special materials can be processed and produced by means of customer supply or purchasing. |
| Package (Imperail) | 0402 | 0603 | 0805 | 1206 | QFN | QFP | SOP/SOIC | SOT23, SOT-363, etc. |
|---|---|---|---|---|---|---|---|---|
| 0402 | 0.15mm (6mil) | 0.18mm (7mil) | 0.20mm (8mil) | 0.25mm (10mil) | 1mm (40mil) | 0.5mm (20mil) | 0.4mm (16mil) | 0.2mm (8mil) |
| 0603 | 0.18mm (7mil) | 0.18mm (7mil) | 0.25mm (10mil) | 1mm (40mil) | 0.5mm (20mil) | 0.4mm (16mil) | 0.20mm (8mil) | |
| 0805 | 0.18mm (7mil) | 0.25mm (10mil) | 1mm (40mil) | 0.5mm (20mil) | 0.4mm (16mil) | 0.20mm (8mil) | ||
| 1206 | 0.35mm (14mil) | 1mm (40mil) | 0.5mm (20mil) | 0.4mm (16mil) | 0.20mm (8mil) | |||
| QFN | 1mm (40mil) | 1mm (40mil) | 1mm (40mil) | 1mm (40mil) | ||||
| QFP | 1.25mm (50mil) | 1.25mm (50mil) | 1mm (40mil) | |||||
| SOP/SOIC | 0.5mm (20mil) | 0.4mm (16mil) | ||||||
| SOT-23, SOT-363, etc. | 0.4mm (16mil) |
| Drilling Parameter | mm | mil | Note |
|---|---|---|---|
| Drill Diameter | 0.15-6.3mm | 6-250mil | Greater holes can be made by hole expansion process |
| Plated Hole Diameter Tolerance | -0.08mm to +0.13mm | -3mil to 5mil | |
| Minimum Non-Plated Hole Size | 0.5mm | 20mil | NPTH should be Marked in Mechanical gerber file |
| Non-Plated Hole Diameter Tolerance | ±0.2mm | ±8mil | |
| Average Hole Plating Thickness | 0.018mm | 0.7mil | |
| Minimum Via Hole Size | 0.15mm | 6mil | Use 0.2mm whenever possible |
| Minimum Via Diameter | 0.25mm | 10mil | Via diameter should be 0.1mm(0.15mm preferred) larger than Via hole size. |
| Minimum Non-Plated Slot Width | 1.0mm | 40mil | |
| Minimum Plated Slot Width | 0.5mm | 20mil | |
| Minimum Via Hole to Hole Spacing | 0.2mm | 8mil | |
| Minimum Pad Hole to Hole Spacing | 0.45mm | 18mil | |
| Minimum Castellated Hole Diameter | 0.5mm | 20mil | |
| Minimum Castellated Hole to Board Edge Spacing | 1.0mm | 40mil | Edges that do not have Casellated holes |
| Minimum Castellated Hole to Hole Spacing | 0.5mm | 20mil |
| Item | Standard | Advanced | Innovative | |
|---|---|---|---|---|
| Tin Lead HASL | Leaded Hot Air Solder Leveling | FR4, Aluminum Cores | A cost-effective PCB surface finish where molten solder is applied to pads, then leveled with hot air. | ✔ Consumer electronics ✔ High-volume orders ✔ Non-fine-pitch components |
| Lead-Free HASL | Lead-Free Hot Air Solder Leveling | FR4, Aluminum Cores | A cost-effective PCB surface finish where molten Lead-Free solder is applied to pads, then leveled with hot air. | ✔ Consumer electronics ✔ High-volume orders ✔ Non-fine-pitch components |
| ENIG | Electroless Nickel Immersion Gold | FR4 and High-Freq Boards | A premium PCB surface finish with a nickel barrier layer and thin gold coating for reliable protection and connectivity. | ✔ High-density designs (HDI, <0.5mm BGA pitch) ✔ Harsh environments (high humidity/temperature) ✔ Gold wire bonding (RF/medical devices) |
ENEPIG | Electroless Nickel Electroless Palladium Immersion Gold | Harsh environment electronics | An advanced, ultra-reliable surface finish combining nickel, palladium, and gold layers for superior performance in demanding applications. | ✔ Gold & Palladium Protection – Prevents nickel corrosion ("black pad" risk) ✔ Wire-Bondable – Supports both gold and aluminum bonding ✔ Lead-Free & RoHS Compliant ✔ Flat Surface – Ideal for fine-pitch/BGA components |
| Hard Gold | Electrolytic Hard Gold | FR4 and High-Freq Boards with Edge connectors or probe contacts | An ultra-durable surface finish with thick gold layer (typically 5-50μm) over nickel, ideal for high-wear applications. | ✔ Exceptional wear resistance – Withstands 10,000+ insertion cycles ✔ Reliable conductivity – Low contact resistance ✔ High-temperature stable – For harsh environments ✔ Wire-bondable – Critical for RF/medical devices |
| ISn | Immersion Tin | HDI Boards | A flat, solderable surface finish where a thin layer of tin is chemically deposited on copper pads, ideal for fine-pitch applications. | ✔ Excellent flatness – Perfect for <0.3mm pitch/BGA ✔ Lead-free & RoHS compliant ✔ Cost-effective – Mid-range pricing |
| OSP (um) | Organic Solderability Preservative | Copper Cores only | A thin, organic coating applied to copper pads to prevent oxidation while maintaining solderability. | ✔ Cost-effective (budget-friendly option) ✔ Flat surface – Ideal for fine-pitch components ✔ Lead-free & RoHS compliant ✔ Simple process – Easy to apply and rework |
| Solder Mask Parameter | mm | mil | Notes |
|---|---|---|---|
| Minimum Solder Mask Expansion | 0.038mm | 1.5mil | Keep at least 0.05mm Spacing between Solder Mask Opening and tracks |
| Soldermask bridge | 2-Layer (1oz): 0.2mm (0.23mm for Black, White) Multi-Layer (1oz): 0.1mm (0.13mm for Black, White) | 2-Layer (1oz): 8mil (9mil for Black, White) Multi-Layer (1oz): 4mil (5mil for Black, White) | The other colors are Green, Red, Yellow, Blue and Purple |
| Solder mask dielectric constant | 3.8 | - | |
| Solder mask ink thickness | ≥ 10μm | - | |
| Via Filling with Solder Mask | - | - | ✔ Filled vias must not have soldermask openings on either side ✔ Filled vias should have ≥ 0.35 mm clearance from other soldermask openings (e.g. pads) ✔ Filled vias must be no wider than 0.5 mm diameter |
| Legend Parameters | mm | mil | Note |
|---|---|---|---|
| Minimum Line Width | 0.15mm | 6mil | Lower width may cause illegible character |
| Minimum Text Height | 1.0mm | 40mil | Lower Height may cause illegible character |
| Character Width to Height Ratio | 1:6 | 1:6 | Keep this ratio wherever possible |
| Minimum Pad To Silkscreen | 0.15mm | 6mil |
| Cutting Parameters | mm | mil | Note |
|---|---|---|---|
| Minimum Copper to V-Cut Spacing | 0.4mm | 16mil | |
| V-Cut Dimensions Tolerance | ±0.4mm | ±16mil | PCB thickness ≥ 0.6 mm |
| V-Cut Groove Angle | 25° | ||
| Minimum Copper to Routed Spacing | 0.2mm | 8mil | |
| Routed Dimensions Tolerance | ±0.2mm | ±8mil | |
| Minimum Copper to Non-Mouse-Bite Board Edge | 0.2mm | 8mil | |
| Mouse Bites Panel Spacing (Moise Bite Edge) | 1.6mm to 2mm | 63mil to 79mil | |
| Recommended Mouse Bite Hole Diameter | 0.5mm to 0.8mm | 20mil to 32 | |
| Recommended Mouse Bite Holes Spacing | 0.2mm to 0.3mm | 8mil to 12mil | |
| Minimum Mouse Bite Tab Width | 5mm | 200mil |
| Special Process | Availability | Description |
|---|---|---|
| Back Drilling | Yes | Removes unused copper stubs from through-holes, Essential for high-frequency designs to: ✔ Reduce signal distortion ✔ Improve high-speed performance ✔ Eliminate EMI risks |
| HDI PCB with Blind/Burried Via | Yes | Enable high-density routing in multilayer boards: ✔ Blind: Connects outer to inner layers ✔ Buried: Links inner layers only ✔ Saves space, improves signal integrity |
| Edge Plating | ✔Minimum PCB Thickness: 0.6mm ✔Minimum PCB Size: 10x10mm ✔Three or more 3mm breaks are required | Protects and conducts on board edges: ✔ Reinforces connector areas ✔ Enhances ground shielding ✔ Prevents delamination |
| Plated Half Holes | Yes | Enable board-to-board connections: ✔ Create castellated edges ✔ Allow direct soldering ✔ Save assembly space |
| Hybrid Material Lamination | Essential for RF, power, and high-speed designs. 4 layers – 10 layers (FR4 + Ro4350, FR4 + Aluminium, FR4 + FPC) | |
How Quick Turn PCB Assembly Can Be Achieved
To differentiate ourselves from manufacturers who merely claim to be quick turn factories, UMO Technology takes concrete steps to ensure fast turnaround and backs it up with reliable performance. Allow us to outline how we achieve expedited processes and highlight our distinguishing factors.
PCBA Production Process
Fast turnaround in the project does not entail eliminating any essential steps in the conventional PCB assembly process. Instead, it focuses on eliminating unnecessary time wastage, automating processes to replace manual labor, and minimizing overtime to increase efficiency. UMO Technology offers a fast prototyping PCBA service that follows the following process:
- Order Receipt: To initiate the process, please provide us with your email address for communication. A dedicated account manager will then contact you to discuss the project requirements in detail and review the PCB design and specifications.
- Circuit Design: If required, we can provide circuit design services or support for electronic manufacturers lacking design capabilities.
- Component Procurement: We will procure the necessary components for the PCBA. This involves placing orders with suppliers or pulling components from our inventory.
- Stencil Creation: A stencil, a thin metal sheet with openings corresponding to the PCB pads, is created. This stencil is used to apply solder paste, which holds the components in place during assembly. The quick full PCB assembly service provider, such as UMO Technology, will generate a stencil based on the PCB design.
- PCB Preparation: The fabricated PCB boards are thoroughly cleaned and prepared for assembly.
- Solder Paste Application: The solder paste is precisely applied to the PCB using the created stencil.
- Component Placement: Our skilled technicians meticulously position the components on the PCB in strict accordance with the design and specifications. During prototype manufacturing, manual placement is often employed to minimize time delays associated with programming automated equipment. However, for mass PCB assembly, our state-of-the-art production line is equipped with automated high-speed placement machines and AI plug-in machines, enabling efficient and precise component placement without sacrificing speed or accuracy.
- Reflow Soldering/Wave Soldering: The PCBA board, with the components securely attached, undergoes reflow soldering or wave soldering in an oven. The high temperature melts the solder paste, forming permanent connections between the components and the PCB.
- Assembly Inspection and Rework: A thorough inspection is conducted to identify any defects, such as incorrect component placement or solder bridges. If necessary, rework is performed to rectify any issues.
- Function Test: The assembled PCB undergoes comprehensive testing to ensure it functions as expected.
- Packaging and Shipping: The finalized PCBA is carefully packaged and promptly shipped to the customer.
Can’t reflect the speed of PCBA manufacturing?
As you can see, the production process itself remains consistent between fast turnaround and regular manufacturing. However, at UMO Technology, we pride ourselves on being a quick turn PCB factory due to several key factors that contribute to the overall speed and efficiency of our operations:
- Self-owned factory: With our manufacturing workshops located in Shenzhen , we have full control over the production schedule. Unlike brokers, we can proactively manage and plan all orders in a manner that optimizes efficiency and minimizes lead times.
- Advanced equipment: We utilize a range of cutting-edge automation equipment to handle large order volumes. Our state-of-the-art machinery includes the Sony AOI inspection machine, ten-temperature-zone reflow soldering equipment, 3D-SPI In-Line SPI equipment, Panasonic SMT placement machines, and more.
- Rush Service: To accommodate urgent projects, we offer a Rush Service option. This service involves “queue jumping” within the production line and the allocation of overtime for our dedicated employees. Additional costs may apply, but it ensures prioritized processing of urgent orders. Please reach out to our customer service team if you require Rush PCB assembly service.
- One-stop service: Our comprehensive one-stop service covers everything from design and procurement to manufacturing and assembly. By providing all-inclusive support, we eliminate the need for customers to source multiple suppliers for different stages of production. This streamlined approach saves valuable time, ensuring a more efficient order fulfillment process.
Ready for Fast Turnaround PCB Assembly?
Fast turnaround is typically associated with prototypes or small batch projects. However, in long-term partnerships with suppliers, there is often a demand for accelerated completion of high-volume PCB assembly orders. Regardless of whether it is for prototyping or high-volume assembly, the fast turnaround service is considered valuable, even if it comes at a higher price. In the following analysis, we will provide a detailed examination of the advantages and disadvantages of this service to assist you in making an informed decision:
Advantages of Fast PCBA
- Time Constraints: When facing project deadlines or the need for speedy product launches, opting for fast prototype PCB assembly is a strategic choice to ensure on-time delivery. The ability to complete projects swiftly serves as a testament to a manufacturer’s capabilities, making it particularly valuable for businesses with time-sensitive projects.
- Large Quantities: Quick turn PCB fabrication allows electronic manufacturers to save time in screening and selecting PCBA suppliers, establishing long-term partnerships with reliable service providers for batch projects. This is particularly advantageous when there is a requirement to generate a significant number of PCBA quickly.
- Cost-Effectiveness: For businesses lacking the necessary personnel or equipment to efficiently manufacture PCBA in-house, engaging the services of a China quick turn PCB assembly factory can be more cost-effective. Outsourcing assembly services eliminates the need for significant investments and overhead costs associated with assembling PCBA board independently.
- Flexibility: Rapid PCB assembly services offer flexibility in terms of production quantities, catering to businesses with varying needs for small-scale or high-volume PCBAs. At FS Technology, we provide valuable design and component selection advice, ensuring that the final circuit board meets the required specifications and functions as expected.
- Expertise: Manufacturers specializing in high-volume quick turn PCBA services employ skilled technicians and designers who contribute to the success of the project and ensure compliance with quality standards. To meet customer demands for rapid turnaround, FS Technology leverages cutting-edge technologies, highly skilled labor, and the latest tools and procedures to deliver high-quality PCB fabrication and production within short timeframes.
Filter Quick Turn PCB Manufacturers
Processing factories, like electronics manufacturers, prioritize speed in their operations. However, achieving timely delivery can be challenging due to various objective factors. When selecting manufacturers, it is crucial to consider the following aspects to ensure their reliability:
- Design Team: The complexity of circuit designs can impact the time required for board fabrication. Suppliers with an in-house design department can streamline the process and optimize production timelines. It is advisable to check if the potential supplier has a competent design team.
- Component Supply: Availability of components can significantly affect the delivery time for rapid PCB bulk assembly projects. Delayed availability of specific components can disrupt the assembly process. To address this challenge, FS Technology’s PCB component procurement team collaborates with top-quality suppliers worldwide. We are proud to provide component procurement services for Fortune 500 companies, such as Volkswagen, ensuring timely access to all required electronic components.
- Advanced Equipment: The production capacity of an assembly plant directly impacts the speed of quick turnaround PCBA. If a facility is operating at maximum capacity, it may not be able to accommodate new projects immediately. Looking at the number of production lines a manufacturer has, and conducting a factory audit if necessary is key to ensure they can execute multiple electronics projects in parallel at the same time.
- Meticulous Testing Services: While comprehensive testing of bulk orders can affect the speed of rapid PCB assembly, it is a crucial stage in the process. To address this challenge, manufacturers need to incorporate meticulous inspection throughout the PCBA production process. In addition to manual PCB inspection, employ advanced equipment such as AOI inspection and X-RAY inspection. These inspection steps may seem time-consuming, but they significantly reduce the need for rework and repair.
- Transportation Service Provider: Transportation lead times often pose a dilemma for fast PCB assembly suppliers, potentially causing delays in electronic projects. FS Technology has established partnerships with reputable transportation companies, ensuring priority delivery. We offer expedited shipping from China to any global destination by sea or air, ensuring both speed and quality in transportation.
Get Rapid PCBA Service From China
Opting for local PCBA services is certainly a valid choice, but it often entails challenges related to quality and price. As the global manufacturing industry shifts towards Southeast Asia, China has emerged as an alternative for many electronics manufacturers.
- Competitive Pricing: Fast turnaround and expedited services inherently come at a higher price. For European and American countries, local manufacturers may not offer the most cost-effective solutions. China, renowned for its manufacturing prowess, provides a cost advantage for expedited services due to lower labor costs.
- Superior Quality: While China’s PCBA industry may have started later than that of European and American countries, it has made significant strides in quality and speed. Chinese quick turn PCB manufacturers offer the best combination of price, quality, and speed, often surpassing other countries like India in terms of quality.
- Effective Communication: Among major foreign trade nations, the English proficiency of the Chinese is noteworthy, minimizing communication barriers arising from language differences. Take FS Technology as an example – our sales team is proficient in English, Russian, Spanish, and more, facilitating detailed project discussions with customers through video conferencing.
- Fewer Limitations: The need for quick turnaround can sometimes restrict PCB design options. Certain parts or design elements may not be readily available or suitable for assembly methods. Chinese manufacturers excel at finding solutions to these challenges, helping you overcome such limitations.
